Kim, Younghee Ko, Doh-Hyung Riu, Soo-Ryong Kim, Byung Ik Kim, Yoon Joo Lee. PREPARATION OF CU NANO POWDER FROM COPPER CONTAINING SPENT ETCHANT
Environmental Resource Lab, Korea Institute of Ceramic Engineering and Technology, 233-5, Gasan-Dong, Guemcheon-Gu, Seoul, Kyunggi Do, 153-801 Korea (yhkokim@kicet.re.kr)
The Cu powder has been recovered from copper containing spent etchant discharged from Printed Circuit Board industry. It has become a substantial environment problem to dispose of spent etchant without any treatment because the etchant contains a significant amount of copper (10-15 w%). In addition, recovery of the copper component from the etchant produced in the PCB industry is important in view of recycling a resource. In this study, we report that the preparation of copper nano powder having needle shape by reduction of copper oxide. Copper oxide precursor was prepared by neutralization of copper containing spent etchant with alkali hydroxide. Sample has been characterized using SEM, XRD, TGA and Atomic absorption spectroscopy. The copper nano powder has been obtained by reduction of copper oxide can be used for EMI shielding, MLCC preparation and so on.